2015 SPEAKERS - as of October 27, 2014

Below is a preview of the 2015 TransPack Forum Speakers. They are listed in alphabetical order. Keep checking back as we will be adding more speakers as well as complete abstracts very soon.

Please contact Lisa Bonsignore at ISTA Headquarters if you have any questions (lisa@ista.org) or 517.333.3437 ext.215. We're looking forward to a terrific program for 2015.

Distribution Discrepancies, How Is Our Product Traveling?
Ryan Crandall, Becton Dickinson,
Packaging Engineer

The Internet of Things: New Technologies that Make Your Packaging Come Alive
Matt Daum, Hewlett-Packard Company,
Global Packaging Manager, InkJet Supplies

Laboratory Evaluation of ASTM D4169 (Current and Proposed) and ISTA Vibration Profiles
Kyle Dunno, Clemson University,
Research Associate


Ergonomics and Manual Material Handling
Susie Elkins, Millwood Incorporated,
Senior Packaging Engineer

How Cost Reduction is Supported by Choosing the Right Testing Method
Ildiko Farkas, NEFAB,
Global Technical Coordinator

Putting All Your Smart Eggs in One Basket: Benefits of Creating a Packaging Center of Competency
Bill Green, IBM,
Senior Technical Staff Member - Packaging Technology

An Analytical Approach to Determine Dynamic Tall Load Stability
John Hayward, Hewlett Packard,
Mgr, Enterprise Package Engineering

Long Term Corrugated Container Compression Performance
Stephen Henning, Hewlett-Packard Company,
Senior Packaging Engineer

The New Era of Pallet Design: The Effect of Packaging Size, Stiffness and Number of Layers on the Load Carrying Capacity of the Pallet
Laszlo Horvath, Virginia Tech - Center for Packaging and Unit Load Design,
Assistant Professor of Practice / Director

Case Study: Matching Field Failures to Lab Failures
Kevin Howard, Packnomics LLC,

Dynamic Analysis of Forklift and Pallet Jack Handling
Budy Notohardjono, Ph.D. PE, STSM, IBM Corp, Shock and Vibration Laboratory,
Senior Technical Staff Member

Development of a New Air Package Transport Test Standard
Paul Singh, FAA,
Hazardous Material Specialist; Packaging Forensics Association, President

Altitude on Random: Why Run Altitude Testing on a Vibration Table?
Luther "Chip" Stone, The Hershey Company,
Engineer, Materials Testing, Packaging

Can We Infer the Stress Level of Distribution Environment from Publicly Available Statistical Data?
Masahiro Takagi, eXcearch Corporation,
Founder & CEO; Japan National Mirror Committee to ISO/TC 122/SC 3

Shelf Life Adoptions - Energy-Aging Graph
Omar Torres, P.E., Stryker,
Packaging Engineer